Computer chips could be 1000x faster as soon as 2013 thanks to new type of glue

Computer maker IBM has gone into partnership with a glue specialist to create ‘skyscraper’ computers – building huge sandwiches of silicon chips by sticking layer after layer of chips covered with tiny components together.

It’s hoped the process will create smartphones and PCs up to 1,000 times faster than today’s – which may be on the market as early as 2013.

The company, 3M, also make heat resistant glues, adhesives used in the aerospace industry and sticky tape – but the hi-tech glues created in collaboration with IBM could actually be the key step towards making the next evolutionary leap in computing

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